Component attachment in lithographic film circuits

Conductive lithographic films are an emerging fabrication process for electronic circuits and systems. This paper reviews the manufacture and properties of CLF conductors, and describes a series of experiments to characterise bonds formed between them and surface-mount-technology (SMT) component packages employing electrically conductive adhesives. The purpose of this work is to directly compare the characteristics of solder joints between SMT packages on screen-printed alumina substrates, and conductive adhesive bonds formed between similar components and CLF substrates. The principal failure mechanisms of film-adhesive bonds in shear on various polymer substrate materials are identified and statistical data on bond strengths presented.