Microstructure and properties of in - situ high entropy alloy matrix composites for electronic packaging shell

The in-situ TiC ceramic particle-reinforced TiCrFeCoNiCu multi-principal-element alloys matrix composites were first successfully prepared by “pre-self-propagating and casting” process and mechanical properties and microstructure of the material were analyzed. The results show that in the CrFeCoNiCuTi-10%vol.TiC composite, the spherical particles of TiC are distributed uniformly in matrix of multi-principal-element alloy, the size of TiC is about tens of microns. The compressive strength and hardness of composite is 2040MPa and 552HV respectively, which is 67% and 12% more than the matrix alloy. The main reason is that the TiC size of the CrFeCoNiCuTi-10%vol.TiC composites is smaller, and the formation of TiC changes the solidification structure of the alloy. The abrasion resistance of the CrFeCoNiCuTi-10%vol.TiC composites is higher than the matrix alloys. The research results can provide a possibility for new shell materials of microelectronics packaging.