Method of fault analysis on typical hybrid Integrated circuit based on nondestructive testing technology

Thick film hybrid integrated circuit is a product of thick film technology and semiconductor technology. Because of some outstanding advantages, such as high reliability and high integration, hybrid integrated circuit has been gradually applied to aerospace electronic equipment. The situation of unstable electrical performance caused by individual parameters exceed standard in the hybrid integrated circuit production process has seriously affected the reliability of the product. In order to improve product quality, the nondestructive testing technology has been used to analyze the cause of the failure and determine the root causes of failure. A variety of prevention and improvement measures have been taken, which greatly avoid the recurrence of similar problems. In this paper, the solid-state power controller (SSPC) that used to replace the relay's role of switching and the breaker's role of protection has been researched, the faults appeared in the production process have been classified, such as function failure partly because of the substrate crack caused by the inappropriate soldering process, the short circuit or open circuit caused by the miss of bonding wires, mistake of bonding place or subsidence of bonding wire, out-of-tolerance of the voltage accuracy caused by the deviation of thick film resistance and the devices failure caused by the wrong process or the defect of some devices. In this paper, the nondestructive testing technology has been used to detect the failure place and failure category. The test parameters and methods have been researched and analyzed to isolate the fault to the relevant parts and component. A kind of fault location algorithm method has been raised to minimize the testing damage of product, assure the overall quality and stability of products.