Effect of Ni/Au plating on the interconnection reliability of bond pad

According to the long-term interconnection reliability of bond pad in plastic encapsulated microcircuits (PEM) devices, Ni/Au electroplating layer was deposited on bond pads, and the effect of Ni/Au plating on pad corrosion and intermetallic compound (IMC) was investigated by corrosion tests and high temperature storage tests. Results show that Ni/Au plating has effectively mitigated the bond strength and electrical connect failure caused by the reliability of bond pads.