Influences of SMD sample preparation and examination conditions on shear test results

In the present paper the influences of design and technological preparation process of SMT test samples and the variation of parameters of shear tests on test results were examined. SMT samples with different sizes of electronic components (1206. 0805, 0603) and different lead-containing and lead-free solder materials were used and their ageing behavior in a temperature cycling process was studied. Further aspects were the test process conditions such as the shear chisel angular position to the components' surface and shear speed. The influence of the sample temperature during the test in the comparison with solder pastes with a low melting temperature was also investigated. The aim of this work was to demonstrate the effect of the co-existence of influences like sample design, materials, sample preparation technology, and test conditions on the shear test results.