Environmental aspects of new embedded power modules with 500 W and 50 kW

Embedding technology enables miniaturisation of electric and electronic components together with improved reliability and thermal stability in harsh environment. This work investigates in form of single case studies the environmental performance from cradle-to-gate of two new designed and fabricated power modules for electric vehicle application with the method of the Sustainable Process Index (SPI) or “ecological footprint”. The SPI results for a 500 W power module demonstrator for e-bikes is 461 m
²
.a/sample and for a 50 kW power module demonstrator for automotive application 18817 m
²
.a/sample. The life cycle impact assessments show, that the wafer manufacturing has the largest impact followed by the silver sinter paste, FR4 material and copper in case of the 500 W Demonstrator, and by the silver sinter paste in case of the 50 kW Demonstrator, respectively. These first results show, that there is further research needed to generate more precise life cycle inventory data for wafer fabrication, FR4 material manufacturing, and the fabrication of metallization sinter pastes including nano-particles.