Influence of flexible substrate roughness with aerosol jet printed pads on the mechanical shear strength of glued joints

This paper presents a research focused on Aerosol Jet printed pads adhesion improvement for electrically conductive adhesives (ECA) testing. The Aerosol Jet technology is able to use nanoparticle inks for deposition process. The adhesion of the ink to the substrate is crucial especially when you realize printing on flexible substrates. The paper will show a new method of adhesion improvement by plasma treatment and fine sandpaper grinding. The adhesion testing was realized by shear strength test of glued joints. Ten SMD chip resistors 1206 were mounted to the electrically conductive adhesive on aerosol jet printed pads for each sample. The advantages, disadvantages and full results of adhesion improvement method are discussed in the paper.