3D Printed Out-of-Plane Antennas for Use on High Density Boards

This paper presents out-of-plane antenna designs for use on high density boards. These antennas are fabricated using 3D plastic printing (additive manufacturing) and subsequent metallization. Various out-of-plane microwave structures including a transmission line, vertical mount microstrip patch antenna, elevated patch antenna, air-lifted patch antenna, and a monopole antenna are demonstrated. These antennas can be integrated directly on packaged chips or mounted vertically on high density electrical boards. Metal patterning on these non-planar structures is carried out using a damascene like process. Details of simulation, fabrication, and measurements are presented.