A Unique Temporary Bond Solution Based on a Polymeric Material Tacky at Room Temperature and Highly Thermally Resistant Application Extension from 3D-SIC to FO-WLP

Among the technological developments pushed by the adoption of Through Silicon Vias and 3D Stacked IC technologies, wafer thinning on a temporary carrier has become a critical element in device processing over the past years. First generation of adhesive materials enabled the integration of the first devices at the expense of capping the thermal budget. Hence new generation materials are being explored to overcome this limitation and further bring the process complexity down.