Design and Demonstration of Highly Miniaturized, Low Cost Panel Level Glass Package for MEMS Sensors

This paper describes an ultra-thin, low cost 3D glass sensor packaging platform for near-hermeticity with novel feedthrough and encapsulation technologies. Glass panels of thicknesses ranging from 50 μm to 300 μm are used which limits overall form factor to 10 MPa) and Dow Chemical's Benzocyclobutene (BCB) 14-P005 is found to be the best candidate for panel level glass-glass bonding. Modelling of the proposed three-layer glass packaging platform was performed in COMSOL Multiphysics. Results show a maximum deformation of about 2.3 μm - 2.5 μm in the BCB and GX-92 bonded package and the least average internal stress of 6.40 MPa in the BCB bonded package. The complete manufacturing cycle starting from cavity formation on bare glass to final 3D assembly to form the lidded/open cavity package including singulation is panel based, enabling significant cost reduction (depending on die dimensions and panel size) compared to ceramic and other substrate technologies.