Crosstalk in ultra-high-speed VLSI interconnects due to substrate-conductivity, temperature, and line-length effects

Effects of substrate-conductivity, temperature, and line-length on crosstalk along ultra-high-speed VLSI interconnects are investigated. Results indicate that the crosstalk does not decrease monotonically with increasing linespacing and also the crosstalk tends to be more oscillatory when the line-length is increased. The crosstalk amplitude is significantly changed when temperature is varied between 265 to 280 Kelvin for 10-50 mm line-length. Furthermore, the crosstalk is eliminated when substrate-conductivity is greater than 0.14 Siemen/meter and temperature is less than 265 K.