RDL layout pattern reliability analysis and optimization with TCAD stress modeling

Reliability analysis is performed for various redistribution layer (RDL) interconnect patterns. Five different RDL patterns are designed to examine die pitch, line length, line width, dummy block, and die edge/corner effects on RDL reliability. Temperature dependent material properties, grain growth induced stress, thermal mismatch stress, and plastic deformation evolution are taken into consideration. It is demonstrated that TCAD stress modeling can be utilized to develop design rules for RDL reliability optimization.