Integrated passive device for TSV (Through-Silicon-Via) interposer

TSV (Through Silicon Via) is one of advanced semiconductor technologies for miniaturization and improved performance at the system integrated circuits. Recently, more complex module should be required this process to be integrated. There specific module for a mobile wireless communication, called TSV (Through Silicon Via) module is now adapted and imbedded with individual passive devices. In this paper I will consider the IPD (Integrated Passive Device) interposer with respect of TSV applications such as Wifi-front-end module. The process technology for TSV will be presented across a range of capacitor structure.