Study of temperature rise of small chip components in case of dense mounting

In this paper, temperature estimation method of heat-generating components in dense mounting was discussed. Specifically, simulation of components arranged densely in a grid pattern on a PCB was carried out. The relationship between temperature rise around the heat generating portion and various conditions such as component pitch and pad size were clarified. Additionally, a temperature estimation formula for the mounting pad part when chip components are densely mounted was derived with a thermal network model.