Thermally-aware sensor allocation for real-time monitoring and mitigation of FEOL aging in System-on-Chip (SoC) applications

A novel aging sensor design, thermally-aware allocation, selection and degradation compensation capability are presented. High resolution, multiple use-case thermal characterization and identification of the temperature sensitive sections of the chip are described. The verification of the sensor based technique is shown with data from current technology nodes. These techniques enable controlling the FEOL aging without exceeding the power requirements of SoC applications.