Application of thermal analysis for study of Sn-Ag electrolytic alloys on to copper and titanium plates

In this work there have been studied the processes of co-deposition and layer-by-layer electrochemical deposition of tin-silver alloys of the given composition with near-eutectic and peritectic content of components. To predict the thermal stability of electrochemical deposition of binary systems there have been conducted the thermal research in characteristics of the electrolytic alloys obtained by DSC method.