Performance projection of III-V ultra-thin-body, FinFET, and nanowire MOSFETs for two next-generation technology nodes

Using state-of-the-art simulation tools ranging from semi-classical Monte-Carlo to full-quantum atomistic approaches, the competitiveness of III-V compounds for next-generation high-performance logic switches is confirmed. A planar double-gate ultra-thinbody (DG-UTB), a triple-gate FinFET, and a gate-allaround nanowire (NW) transistor have been designed according to the ITRS specifications for two technology nodes with physical gate lengths of L
_G
=15 nm and 10.4 nm. A thorough performance comparison of digital and analog figures of merit at these nodes reveals that for L
_G
=15 nm, the performance of planar and 3-D architectures is comparable. At L
_G
=10.4 nm, the III-V NW promises the highest performance, especially when lowering the supply voltage from 0.59 V to 0.50 V. It also significantly outperforms its strained silicon counterpart. Finally, the effects of series resistance combined with interface traps, surface roughness, alloy scattering, and electron-phonon interactions have been found to deteriorate the III-V ballistic ON-current by 50-60%.