Systematic validation of 2x nm diameter perpendicular MTJ arrays and MgO barrier for sub-10 nm embedded STT-MRAM with practically unlimited endurance

We present a comprehensive device and scalability validation of STT-MRAM for high performance applications in sub-10 nm CMOS by providing the first statistical account of barrier reliability in perpendicular magnetic tunnel junctions (pMTJs) from 70 to 25 nm diameter in 1 Gbit arrays. We have experimentally investigated the time-dependent dielectric breakdown (TDDB) properties and the dependence of the pMTJ lifetime on voltage, polarity, duty-cycle, and temperature. A large write-to-breakdown voltage window of > 1 V (> 20 σavg) was measured and a long time-to-breakdown was projected (> 10
¹⁵
cycles) for 45 nm pMTJs, guaranteeing practically unlimited write cycles. We also reveal a dramatic enhancement of barrier reliability in conjunction with pMTJ size scaling down to 25 nm diameter, further widening the operating window at deeply scaled nodes.