A 48-well transparent microelectrode array fabricated utilizing a flexible, “wrapped around” interconnect technology

This paper describes the microfabrication, assembly and preliminary characterization of a flexible multi-layer circuit wrapped around a base plate utilized as a high-throughput 48-well Microelectrode Array (MEA) device. Roll to roll flexible circuit technology allows for fine lines and spaces (<;25 μm) to be fabricated in a large area fashion and has been exploited for the first time to our knowledge toward a high-throughput MEA application. Utilizing this technology to develop a microelectrode array has the opportunity to provide cost-effective, disposable consumable devices to the high-throughput biotechnology and biosensor screening markets. The flexibility allows for the circuit to be wrapped around a rigid substrate, thereby allowing backside interconnectivity and eliminating the need for expensive conductive through vias and lowering the number of processing steps. This device has been further assembled and characterized.