Towards a common integration platform for photonics and electronics. Challenges for assembly and packaging

In this paper we summarize our experience developing photonic-based millimeter and terahertz signal generation systems. Our main aim is to develop such systems on an integrated technology platform, which must combine photonic as well as electronic components. Therefore, we aim towards microwave photonic integrated circuits, which combine photonic and radiofrequency electronic techniques. Integration increases chip complexity bringing challenges for packaged components.