Development of fine pitch interconnections for 3D integrated circuits

As the electronic devices miniaturization roadmap trend is pursuing, 3D technologies have also emerged and appeared as one serious option for the next generation of semiconductors industry. The purpose of this paper is to introduce the complete development of fine pitch microbumps and micropillars for chip to wafer interconnections on 300 mm wafers using industrial tools and with already existing process. Our goal is to use production process and materials to simplify industry transfer. Good morphological and electrical results showed a process robustness that may be suitable for an industrial approach.