Thermoresistive properties of nanodimentional film materials based on Pd or Au and Fe or W as elements of integrated electronics

The results of research of phase composition and thermoresistive properties of nanodimentional film materials based on Pd or Au and Fe or W, indicating their high thermal stability in the temperature range 300-850 K. The conclusion about the possibility of using such materials as diffusion barriers for multilayer metallization systems in elements of integrated electronics (films based on Pd and W) and sensitive elements of thermistor and temperature sensors (film based on Pd or Au and Fe).