High thermal stability of SiC packaging with thermosetting imide-based nanocomposite encapsulating materials combined with sintered Ag paste die-attach

Heat-resistance of novel encapsulating materials made from thermosetting imide/silsesquioxane nanocomposites are demonstrated in SiC-SBD packages, which are die-attached with a sintered Ag paste. The test specimens are exposed to thermal cycling between -50°C and 250°C and humidity resistance evaluation test at 121°C, 0.19MPa, 95%Rh. The results reveal that the excellent heat and humidity-resistance is brought by the outstanding stability of the thermosetting imide-based nanocomposite encapsulating materials and its remarkable miscibility to sintered Ag die-attach.