The failure mechanism investigation of the polymer ball interconnected CBGA under board level thermal mechanical stress

The polymer cored solder interconnect has been evaluated in board level strain concerned ball grid array type IC package for many years. The innovative ball design is developed to compensate the board level reliability weakness of current metal alloy interconnect such as mechanical and thermal fatigue endurance due to its unique spherical polymeric core able to absorb the strain energy generated during the service in field.