Study of interconnection between Ni nano-array and nano-Ag solder

As the integrated circuit and semiconductor industry developing rapidly, traditional micro-joining technology can not meet the new high-power devices challenge. Due to the size effect, nano-materials can offer low-temperature connection and high-temperature service property, which may be a promising approach for the high-power application. In the interconnection process, such as nano-Ag solder, the sintering temperature is much higher than the theoretical calculating value. This huge temperature difference is related to the microstructure gap between the nanostructure and the conventional pad. In order to achieve the low-temperature joining and increase the interconnection efficiency, the Ni nanostructure was deposited on the Cu pad surface by the electrochemical method in this paper. The Ni nanostructure could reduce the size difference between the nano-solder and the traditional pad. It is significant to control the Ni surface nanostructure. The electrochemical parameters, such as current density and temperature were studied. The surface nanostructure and nano-solder sintering process were investigated. The interconnection can be completed in lower temperature compared with the traditional joining process. The whole connection could be finished more efficiently.