Design for additive manufacturing of wide band-gap power electronics components

This extended digest is focused on design for additive manufacturing of next-generation wide band-gap power electronics components, where high operating frequencies, on the order of 100 kHz to 100 MHz, and high volumetric power densities are expected. Common components that enable future WBG power electronics systems, namely high frequency circuit-level magnetics and system-level high performance cold plates for thermal management, are discussed in the context of additive manufacturing. In both cases, three-dimensional printing enables performance enhancements that are explained in detail. Future opportunities for, and challenges in, the application of additive manufacturing to the realization of wide band-gap system components is additionally described.