Large Panel Level Fan Out Package Built up Study with Film Type Encapsulation Material

Die first and face up type FO-PLP preparation was studied referring the organic substrate fabrication process. 660 mm x 515 mm size carrier was used and 640 mm x 495 mm area was encapsulated with the film molding material comparing with granule material. 3 mm x 3mm to 10 mm x 10 mm dies were mounted on the panel using temporary adhesive. Die shift at compression molding was evaluated in each die size. Larger die showed smaller die shift distance. The affection of the carrier CTE to the die shift was also investigated. The board which had CTEs of 6, 8, and 14 ppm/K were used. CTE of 14 ppm/K material showed the minimum di shift. Tracking of the warpage during the preparation process by each process step indicated that each material selection can control the warpage. Wiring layer was fabricated on the die molded panel which had the size of 510 mm x 407 mm. Laminate type insulation material was used. Filled via of 35 micron diameter and L/S = 15 / 15 micron was formed by 355 nm laser drilling and SAP.