Multichip module technologies for high-speed ATM switching systems

High-performance, compact multichip modules (MCMs) using a copper polyimide multi-layer substrate are used to make a 40-Gb/s-throughput ATM switching module. The MCM substrate has 392 high-speed signal I/0 channels, thin-film termination resistors, and 50 /spl mu/m laminated capacitance layers. We made a sub switching element module using these MCMs, new high-speed FPC cables, and heat pipes fins. This sub-switching element module can operate at 80 Gb/s throughput.