Experiments on the ultrathin silicon vapor chamber for enhanced heat transfer performance

The evaporator and condenser of the silicon vapor chamber have been fabricated by photolithograph and deep reactive-ion etching, and they have been bonded hermetically by Au-Si eutectic bonding and soldered with charging tubes for testing. To simulate concentrated heating of a working device and measure its temperature, a Platinum heater and four resistance thermometers have been fabricated by the electron beam deposition and lift-off process. An experimental rig has been built to charge the silicon vapor chamber and test the performance of the designed vapor chamber. And a copper liquid cooler connected to a chiller has been assembled to remove heat. The experimental results of the silicon vapor chamber prototype demonstrated an excellent performance against uncharged control sample with heat flux of 15 W/cm
²
under 15°C superheat.