Towards the realization of optical interconnets on Si interposer

The continuously increasing demand for higher bandwidth makes the application of an optical chip to chip interconnect system conceivable. Based on the assumption of a 3D chip package two essential ingredients of such a system are the availability of optical TSVs and a cost efficient process to fabricate waveguides with an efficient coupling to and from the optical TSV. In this paper, we present results on different kinds of optical TSVs. Our waveguide TSV is based on a SU-8 optical core. We developed a fabrication process for horizontal optical waveguides made as well by SU-8 using special imprint lithography.