Wired and wireless high-speed communications enabled by plasmonics

Speed, footprint, power consumption and economiy of costs are key factors in the field of communications. The new field of plasmonics promises THz bandwidth devices with a micrometer footprint operating with fJ/bit at prices that scale similar to what is known from the CMOS industry. In this paper we will review recent advances in the field of plasmonics. An emphasis will be on the plasmonic organic hybrid platform with which we recently demonstrated the first 108 Gbit/s modulator, introduced a novel ultra-dense plasmonic interconnect solution or demonstrated a new radio-over-fiber scheme.