Test Structures for the Wafer Mapping and Correlation of the Properties of Electroplated Ferromagnetic Alloy Films

This paper presents a method of electrically determining the permeability of patterned, electroplated ferromagnetic alloys and brings together the simultaneous wafer mapping of relative permeability, electrical resistivity, and mechanical strain of these electrodeposited films, as well as the layer thickness and alloy composition. The wafer mapping of all these properties is implemented using a set of simple, automated electrical and optical techniques that facilitate the quantification of the spatial correlation between different parameters. This enables the uniformity of conductive ferromagnetic films to be analysed and supports the optimization of the physical properties of these materials as well as the processes used to deposit them.