Study of relationship between copper patterns and temperature rise of printed circuit board for small surface mount electronic devices using constriction thermal resistance

The circuit (printed board) designers play an important role in the recent thermal design of electronic devices. Generally, small chip type components have low heat generation. However, recently, the heat generation density of small chip type components is increasing along with the downsizing of electronics. Small chip type components have no cooling devices, and heat dissipation from the components is mainly done through the copper patterns on the board. Therefore, if the design of copper pattern on the board is inadequate, generated heat from the components cannot be dissipated, and there will be a risk of excessive temperature rise.