Hot Chips: Stacking tutorial

This article consists of a collection of slides from the author's conference presentation. Presents a tutorial on stacking many applications on a mobile platform. Some of the specific topics discussed include: types of application stacked; bandwidth allocation and extensions; memory extensions, three-dimensional stacking on chips; manufacturing and packaging processes that support stacking applications; process validation; bonding and dry etching methods; and dielectric deposition. Assesses the advantages and disadvantages of various stacking methods. Also examines the market opportunties for commercialization of various stacking applications, i.e., image sensing, CPU and GPU memory, field programmable gate arrays, and memory management.