Parallel FETI-DP algorithm for defect detection in large-area nanopatterned wafers

An efficient parallelization of the dual-primal finite-element tearing and interconnecting algorithm (FETI-DP) is presented for detecting defects in large-area nanopatterned wafers. To reduce global communication, iterative solvers with an iterative classical Gram-Schmidt scheme and a communication-avoiding approach are implemented to solve the interface and the coarse corner problems, respectively. A preconditioner is developed to improve the iterative convergence of the coarse problem. Electromagnetic analysis of a wafer is presented to show the scalability and capability of the method for accurate defect detection.