Microstrip-to-microstrip interconnects with conductive adhesive bonded ribbons for micro- and millimeter wave applications

A simple chip-to-chip interconnect technique with adhesive bonded ribbons is presented. It solves the insertion loss problem of wire bond interconnects in micro- and millimeter wave assemblies. This paper discusses design and fabrication of such interconnects. A quasi-static model is developed to ease the quality assessment of their electrical behaviour. It is validated by measurements on microstrip resonators with and without interconnects. The chip-to-chip interconnect technique with adhesive bonded ribbons exhibits low loss and is useable up to 50 GHz or more.