Warpage characterization of glass interposer for BGA package application

Glass interposer is proposed as a superior alternative to organic and silicon-based interposers for 3DIC packaging in the near future. An excellent dielectric material and could be fabricated with large size, the several attractive advantages such as excellent electrical isolation, better RF performance, better feasibility with CTE and most importantly low cost solution. However, the thin glass is extremely brittle and new material for BGA package assembly process, so how to select suitable material properties of glass substrate and epoxy molding compound, then realize the warpage phenomenon is the key topic. In this work, finite element analyses were carried out to explore warpage control for glass interposer in BGA package. Besides, the three Dimensional (3-D) AVATATR, as a non-contact optical deformation measurement method also used to measure 8″ glass wafer with molding compound warpage behavior with different temperatures. Impact from the material properties selection of glass substrate and EMC for warpage control during thermal manufacture process is studied in this paper.