Microwave and millimeter wave ball grid array (BGA) packages

In order to realize the large growth potentials of commercial wireless market segments such as local multi-point distribution services (LMDS) and point-to-point radio, system manufacturers must produce affordably-priced equipment for the consumer. One key issue is reducing the cost of packaging for monolithic microwave integrated circuits (MMICs) for these applications, which operate in the frequency range of 18 to 40 GHz. This paper explores the applicability of ball-grid array (BGA) technology as an economical solution to microwave and millimeter-wave MMIC packaging.