Power, performance, and cost comparisons of monolithic 3D ICs and TSV-based 3D ICs

Power, performance, area, and cost analysis of TSV, mini-TSV, and monolithic 3D ICs is presented. Power savings for TSV, mini-TSV, and monolithic 3D ICs are 21%, 25%, and 37%, respectively, compared to that of a 2D IC. It is shown that monolithic 3D can deliver one node PPC benefit, whereas TSV 3D or mini-TSV 3D can only achieve a half node PPC advantage.