Investigation of flat-pack IGBT reliability

High power and high reliable IGBTs are used in applications to traction and high voltage converters. We have investigated a flat-pack IGBT, compared with an IGBT module and a GTO, to realize the ruggedness in electrical, thermal and mechanical stresses, and the long term reliability. The thermomechanical behaviors on the Si chip surface are discussed, based on two-dimensional numerical simulation results and power cycling test results.