A Study On The High Temperture Platinum Etching

It is necessary to use the platinum as a bottom electrode material of the BST capacitor in highly integrated deveces, however the Pt etching of the fine patterns is difficult due to the inherent non-reactivity of platinum. It is revealed that the Pt etch slope of 80° was attained by OJ Cl2 chemistry by elevating the substrate temperature up to 160° C. This result is thought to be due to the reaction of O species with TI layer and analyzed by TEM, XPS and AES.