Reliability analysis of and experiment test on SAC305 solder balls

The thermal cycle analysis of the module on the basis of physical electronic packaging is researched in this paper, and the stress-strain hysteresis curve and the life of dangerous SAC305 lead-free solder balls are analyzed as the screw positions change. The related experiment is performed, and the results show that when the screw position is near to the chip, the life of SAC305 is longer, while it is farther, the life is shorter, which are in good agreement with the simulation results.