Thin-Copper-Metal Interconnection Thermomigration Analysis in ESD Regime

Technological scaling poses severe constraints on the design of metal interconnections, particularly for ESD protection network routing in advanced smart-power technologies. A detailed analysis of thin-interconnection failure mechanisms under high power pulses and their related root causes is mandatory. In this paper, this analysis is illustrated using characterizations, failure analyses, and 3-D TCAD physical simulations data.