Overview of non-volatile memory packaging needs and approaches for space based systems

Summary form only given. Arguably, the most challenging requirements for the packaging of nonvolatile memories originates in the need for extremely low power/mass, high performance/reliability data storage in space based systems. Extremes in environmental factors including temperature, mechanical and thermal shock, and radiation are just some of the factors which the microelectronics package is required to deal with. This presentation presents some of the needs of the newest generation of spacecraft, as well as some of the approaches being used to package these mission critical components.