Bump resistance change behavior due to Cu-Sn IMCs formation with various solder diameters

Theoretical calculation and simulation of FEM were proposed to explain the decline of change in resistance in Cu-Sn microbumps during the electromigration test. The IMC transformation from Cu
₆
Sn
₅
to Cu
₃
Sn was supposed to be the reason. Being aware that the dimension keeps shrinking, the behavior for various solder diameters was also investigated.