Study of thermal cycling and temperature aging on PbSnAg die attach solder joints for high power modules

High power modules are still facing the challenges to increase their power output, increase the junction temperature, and increase their reliability in harsh conditions. Therefore in the full paper from this study a detail analysis of this solder joint was reported [1]. The intermetallic phases and the microstructure of standard chip to substrate solder joint will be analysed and compared to deteriorated joints coming from modules which have undergone an active thermal cycling.