High-g MEMS shock threshold sensor integrated on a copper filling through-glass-via (TGV) substrate for surface mount application

This paper presents the fabrication of a through-glass-via (TGV) substrate with an integrated high-g MEMS shock threshold sensor on it, which will minimize the die size of the whole sensor, avoid lead-wire bonding and facilitate the surface mount. Moreover, smaller volume could also improve the anti-shock capability of the sensor. The TGV substrate is fabricated by developed composite-mask powder blasting and copper filling technology. The jet trace and distribution of the particles with different sizes during the powder blasting has been simulated by ANSYS finite-element method. The relationship of etching depth and blasting time under different mask opening sizes is evaluated. Fabricated via holes are filled successfully by periodic pulse reveres (PPR) electroplating copper. Finally, the all-metal shock threshold sensor is integrated on the TGV substrate by surface micromachining. And the integrated sensor has a reliable switch-on signal when 1000g shock acceleration is applied.