Effect of silver alloy bonding wire properties on bond strengths and reliability

In the study, the effect of silver alloy bonding wire properties on bonding strength was evaluated and the IMCs layer growth under these conditions was also discussed. It was found that the Zn elements in silver alloy bonding wire can decrease the coefficient of heat conductivity, the coefficient of heat conductivity is smaller 16%, and avoid to form golf ball and sharp ball. Long HAZ length will cause the ball neck crack and lead to black bonded or failure bonded, Zn elements can increase the recrystallized temperature, then decrease the HAZ length, the HAZ length decreased 25%. After HTS test, cracks phenomenon happens at the bonding interface because of Ag atoms rapidly migrate, Zn can decrease the Ag migrate rate and avoid the crack in bonded interface.