Substrate noise coupling isolation using P+ contact array and grid ground plane in RF/mixed-signal 3D TSV ICs

In this paper, a substrate noise suppression method using P+ contact array and grid ground plane is proposed, which yield excellent noise suppression below -60 dB in extremely wide frequency range from DC up to 50 GHz. P+ contact array suppresses the low-frequency noise while the grid ground suppresses the high-frequency noise. Accurate circuit models are developed by simple extraction. The noise suppression performance of the proposed structure is compared with guard ring. Results show that our method yields excellent noise suppression performance.