An electrothermal PIN diode model with substrate injection

This paper presents a compact model for an integrated 3-terminal PIN diode suitable for SPICE simulation. The model described within represents a significant extension to the standard 2-terminal diode model of SPICE, capturing phenomena critical to the accurate prediction of diode behavior in modern integrated process technologies. In particular, the inclusion of self-consistent electrothermal modeling and substrate injection effects is key to improving simulation accuracy for diodes operating in a forward conductive state, such as would be common for PIN diodes. The model is implemented in Verilog-A and hardware-verified results are presented for a 90nm SiGe BiCMOS technology featuring a high-performance integrated PIN diode.